Universal pad arrangement for surface mounted semiconductor...

Details Universal pad arrangement for surface mounted semiconductor... Universal pad arrangement for surface mounted semiconductor...

2011-06-28

2011-06-28

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S691000, C257S723000, C257SE23001, C257SE23194

Reexamination Certificate

active

07968984

ABSTRACT:
An apparatus for coupling a plurality of surface mounted semiconductor device packages to a circuit board is provided. Each package including a semiconductor device die and a metal clip including a flat web portion having a bottom surface and at least one peripheral rim portion extending from an edge of said flat web portion, said bottom surface having solderable planar metal electrodes or pads on its bottom surface, the contact pads being formed in plurality of layouts having one or more columns and one or more rows. The apparatus including a circuit board contact pattern including one or more columns and one or more rows of contacts, a number of rows being equal to a largest number of contact pad rows in the plurality of contact pad layouts, a number of columns being equal to a largest number of contact pad columns in the plurality of contact pad layouts. The circuit board contact pattern is usable by all of the plurality of the contact pad layouts of the plurality of semiconductor device packages.

REFERENCES:
patent: 4489365 (1984-12-01), Daberkoe
patent: 6624522 (2003-09-01), Standing et al.
patent: 2001/0048116 (2001-12-01), Standing
patent: 2005/0087847 (2005-04-01), Kuan et al.
patent: 503487 (2002-09-01), None
International Search Report dated Nov. 28, 2007 issued in the corresponding PCT Application No. PCT/US06/41813.

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