Ultra thin, leadless and molded surface mount integrated circuit

Details Ultra thin, leadless and molded surface mount integrated circuit Ultra thin, leadless and molded surface mount integrated circuit

1996-07-26

1999-02-02

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257678, 257690, 257693, H01L 2348, H01L 2302, H01L 2352

Patent

active

058669418

ABSTRACT:
The present invention is an integrated circuit package that comprises a substrate whose top side has a number of conductive and insulative portions. A die on which an integrated circuit is fabricated is placed on the top side of the substrate. A number of bond wires connect on chip electrical connection pads to respective conductive portions of the top side of the substrate. Each conductive portion on the top side of the substrate is connected to a respective solder plated/dispensed pad on the bottom side of the substrate. A molding compound is formed on the top side of the substrate to encapsulate the die and the bond wires. The bottom side of the substrate, including the solder plated/dispensed pads, remains unmolded. The invention represents a number of advances in the art. For example, the invention results in an ultra thin package that can be used in PCMCIA Type I and Type II modules and cards. One embodiment of the ultra thin package of the invention has a thickness of approximately 0.70 millimeters.

REFERENCES:
patent: 4868638 (1989-09-01), Hirata et al.
patent: 5334857 (1994-08-01), Mennett et al.
patent: 5446313 (1995-08-01), Masuda et al.
patent: 5468995 (1995-11-01), Higgins
Electronic Packagin and Ineterconnection Handbook, pp. 7.24-7.26, C. Harper .

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