Ultra thin dual chip image sensor package structure and...

Details Ultra thin dual chip image sensor package structure and... Ultra thin dual chip image sensor package structure and...

2007-06-05

2007-06-05

Doan, Theresa T. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000

Reexamination Certificate

active

11415581

ABSTRACT:
A stacked image sensor package contains an image sensor chip and a peripheral chip. A support pad for the peripheral chip adheres to a top surface of the peripheral chip, eliminating the need for a support member that otherwise would contribute to the thickness of the package. Thermal dissipation is enhanced by exposing surfaces including a back surface of the peripheral chip.

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patent: 6452278 (2002-09-01), DiCaprio et al.
patent: 6521881 (2003-02-01), Tu et al.
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patent: 6713857 (2004-03-01), Tsai
patent: 6731015 (2004-05-01), Wu et al.
patent: 7045888 (2006-05-01), Tsai et al.

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