Universal interconnect die

Details Universal interconnect die Universal interconnect die

2006-07-18

2006-07-18

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S690000, C257S786000

Reexamination Certificate

active

07078792

ABSTRACT:
A device for electrically interconnecting one or more semiconductor devices to provide for flexibility in wiring and preventing long or shorted leads and methods for fabricating and using same. The device has a substrate with a plurality of substantially concentric electrically-conductive paths, each of the plurality of electrically-conductive paths being electrically isolated from each other and formed on a first surface of the substrate. At least one of the plurality of electrically-conductive paths is arranged concentrically so as to substantially span a width of the first surface of the substrate. A plurality of bonding pads is electrically coupled to each of the electrically-conductive paths. The plurality of bonding pads is coupled to one of the electrically-conductive paths and is electrically isolated from bonding pads located on any other electrically-conductive path. The entire interconnect device may be mounted in a standard leadframe product.

REFERENCES:
patent: 6249047 (2001-06-01), Corisis
patent: 6376914 (2002-04-01), Kovats et al.
patent: 6384476 (2002-05-01), Takeuchi
patent: 6511901 (2003-01-01), Lam et al.
patent: 6770963 (2004-08-01), Wu
patent: 6798056 (2004-09-01), Matsuura et al.
patent: 6812557 (2004-11-01), Matsuo et al.
patent: 2002/0027280 (2002-03-01), Corisis et al.
patent: 2003/0006498 (2003-01-01), Hirayama
patent: 2005/0173793 (2005-08-01), Rohrmoser et al.

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