Ultra wideband system-on-package

Details Ultra wideband system-on-package Ultra wideband system-on-package

2009-10-22

2011-11-01

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S700000, C257S723000, C257SE25005, C257SE25010, C257SE25011, C257SE25012, C257SE25015, C257SE25016, C257SE25020, C257SE25023, C257SE25025, C257SE25026

Reexamination Certificate

active

08049319

ABSTRACT:
This research discloses an ultra wideband system-on-package (SoP). The SoP includes a package body; a first integrated circuit mounted on the package body; a first signal transmission unit connected to the first integrated circuit; a signal via connected to the first signal transmission unit and including a slab line and a trough line; and a second signal transmission unit connected to the signal via. The technology of the present research can transmit ultra broadband signals by minimizing discontinuity of signals appearing during vertical transition that occurs in the course of a signal transmission to/from an external circuit, and a fabrication method thereof.

REFERENCES:
patent: 6876056 (2005-04-01), Tilmans et al.
patent: 6936913 (2005-08-01), Akerling et al.
patent: 7119425 (2006-10-01), Jeong et al.
patent: 7531905 (2009-05-01), Ishino et al.
patent: 7622327 (2009-11-01), Chrysler et al.
patent: 7727807 (2010-06-01), Han
patent: 7727887 (2010-06-01), Christensen et al.
patent: 7786563 (2010-08-01), Hoang et al.
patent: 7804688 (2010-09-01), Wakabayashi et al.
patent: 7838967 (2010-11-01), Chen
patent: 7868462 (2011-01-01), Choi et al.
patent: 2006/0291110 (2006-12-01), Kanno et al.
patent: 2007/0177357 (2007-08-01), Wakabayashi et al.
patent: 2007/0231970 (2007-10-01), Fukuo et al.
patent: 2007/0285211 (2007-12-01), Kim et al.
patent: 2008/0142935 (2008-06-01), Montoriol et al.
patent: 2008/0157284 (2008-07-01), Chang et al.
patent: 2008/0185718 (2008-08-01), Suh et al.
patent: 2008/0203554 (2008-08-01), Nishio et al.
patent: 2009/0034206 (2009-02-01), Lu et al.
patent: 2009/0129422 (2009-05-01), Edris et al.
patent: 2009/0180225 (2009-07-01), Pan et al.
patent: 2009/0219668 (2009-09-01), Hsu et al.
patent: 2010/0135611 (2010-06-01), Asai et al.
patent: 2010/0314714 (2010-12-01), Nakamura
Ki Seok Yang et al., “Low-Loss Integrated-Waveguide Passive Circuits Using Liquid-Crystal Polymer System-on-Package (SOP) Technology for Millimeter-Wave Applications”, IEEE Transactions on Microwave Theory and Techniques, Dec. 2006, pp. 4572-4579, vol. 54, No. 12.
Inkwon Ju et al., “High Performance Vertical Transition from DC to 70 GHz for System-on-Package Applications”, Proceedings of the 38th European Microwave Conference, Oct. 30, 2008, pp. 1338-1341, EuMA, Amsterdam, The Netherlands.

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