Underside heat slug for ball grid array packages

Details Underside heat slug for ball grid array packages Underside heat slug for ball grid array packages

1998-07-21

2000-05-09

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257738, H01L 2310

Patent

active

060607777

ABSTRACT:
An integrated circuit package which includes an integrated circuit that is attached to a first side of a substrate. The package may also have a solder ball and a heat slug that are both attached to a second side of the substrate. The heat slug and solder ball can be attached to a printed circuit board. The heat slug can provide a thermal path from the substrate to the circuit board which has a relatively wide area. The wide area reduces the thermal impedance and the junction temperatures of the integrated circuit for a given amount of heat.

REFERENCES:
patent: 5172301 (1992-12-01), Scneider
patent: 5287247 (1994-02-01), Smits et al.
patent: 5583377 (1996-12-01), Higgins, III
patent: 5751063 (1998-05-01), Baba
patent: 5834839 (1998-11-01), Mertol
patent: 5856911 (1999-01-01), Riley

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