Ultra thin dual chip image sensor package structure and...

Details Ultra thin dual chip image sensor package structure and... Ultra thin dual chip image sensor package structure and...

2006-05-16

2006-05-16

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000

Reexamination Certificate

active

07045888

ABSTRACT:
A thin stacked image sensor package containing an image sensor chip and a peripheral chip. A support pad for the peripheral chip adheres to a top surface of the peripheral chip, eliminating the need for a support member that otherwise would contribute to the thickness of the package. Thermal dissipation is enhanced by exposing surfaces including a back surface of the peripheral chip.

REFERENCES:
patent: 5523608 (1996-06-01), Kitaoka et al.
patent: 6372551 (2002-04-01), Huang
patent: 6521881 (2003-02-01), Tu et al.
patent: 6559539 (2003-05-01), Tu et al.
patent: 6713857 (2004-03-01), Tsai
patent: 6731015 (2004-05-01), Wu et al.

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