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Three commonly housed diverse semiconductor dice

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Three commonly housed diverse semiconductor dice

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Three dimensional device integration method and integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Three dimensional integrated circuit and method of making...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Three dimensional integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Three dimensional package for monolithic microwave/millimeterwav

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Three dimensional packaging configuration for multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Three dimensional semiconductor package having flexible appendag

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Three dimensional stack package device having exposed coupling l

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Three-dimensional flexible assembly of integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Three-dimensional memory card structure with internal direct chi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Three-dimensional memory stacking using anisotropic epoxy...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Three-dimensional module comprised of layers containing IC...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Three-dimensional multichip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Three-dimensional multichip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Three-dimensional multichip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Three-dimensional multichip packages and methods of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Patent

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Three-dimensional multichip stack electronic package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Three-dimensional multimodule HDI arrays with heat spreading

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Three-dimensional package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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