Three-dimensional multichip module

Details Three-dimensional multichip module Three-dimensional multichip module

1993-07-30

1994-12-13

Munson, Gene M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257704, 257723, 361735, H01L 2302, H05K 700

Patent

active

053731891

ABSTRACT:
Three-dimensional multichip module.
The invention relates to a three-dimensional or 3D multichip module having a plurality of bidimensional, elementary electronic modules (4a-4d), each incorporating at least one chip (10a-10d), a support (6a-6d) on which is placed the chip and a conductive interconnection network or array (8a-8d) covering an upper surface of the support. These elementary modules are substantially superimposed in a displaced manner (in the form of a staircase) and are interconnected by means of their interconnection networks and connection pads (12a-12d) placed on those parts of the elementary modules not covered by the upper elementary module.
Application to the association of integrated circuits in microconnection technology.

REFERENCES:
patent: 4956694 (1990-09-01), Eide
patent: 5019943 (1991-05-01), Fassbender et al.
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5311401 (1994-05-01), Gates et al.
patent: 5313096 (1994-05-01), Eide

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