Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2011-07-26
2011-07-26
Nguyen, Thinh T (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S723000, C257S724000
Reexamination Certificate
active
07986033
ABSTRACT:
A three-dimensional multichip module includes a first integrated circuit chip having at least one first high-temperature functional area and one first low-temperature functional area, and at least one second integrated circuit chip having a second high-temperature functional area and a second low-temperature functional area. The second high-temperature functional area is arranged opposite the first low-temperature functional area. As an alternative, at least one low-temperature chip having only one low-temperature functional area can also be arranged between the first and second chips.
REFERENCES:
patent: 5760478 (1998-06-01), Bozso et al.
patent: 5783870 (1998-07-01), Mostafazadeh et al.
patent: 5977640 (1999-11-01), Bertin et al.
patent: 6040203 (2000-03-01), Bozso et al.
patent: 6075287 (2000-06-01), Ingraham et al.
patent: 6433413 (2002-08-01), Farrar
patent: 7190068 (2007-03-01), Hackitt et al.
patent: 2005/0173807 (2005-08-01), Zhu et al.
patent: 0 827 203 (1997-07-01), None
patent: WO 2006/012167 (2006-02-01), None
Scott Mueller , Upgrading and Repair PC ( Sep. 2001 ) 13thedition, Que, pp. 131,134,185.
“Assembly and Packaging: Technology Requirements,” The International Technology Roadmap for Semiconductors: 2003, pp. 472-473.
Pozder, S., et al., “Back-End Compatibility of Bonding and Thinning Processes for a Wafer-Level 3D Interconnect Technology Platform,” Interconnect Technology Conference, 2004, International Proceedings of the IEEE 2004, Jun. 7-9, 2004, pp. 102-104, IEEE.
Infineon - Technologies AG
Nguyen Thinh T
Slater & Matsil L.L.P.
LandOfFree
Three-dimensional multichip module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Three-dimensional multichip module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three-dimensional multichip module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2701841