Three-dimensional multichip stack electronic package structure

Details Three-dimensional multichip stack electronic package structure Three-dimensional multichip stack electronic package structure

2007-05-01

2007-05-01

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S697000, C257SE23048

Reexamination Certificate

active

11437718

ABSTRACT:
The present invention relates to a three-dimensional multichip stack electronic package structure and method for making the same, including a main substrate having at least a pin-hole set and at least a flexible substrate having at least a pin terminal. At least an electronic device including an active component and a passive component is attached to the flexible substrate by adhesion. In the flexible substrate, electric signals of the electronic device are delivered to the pin terminal through at least a conductive wire for transmitting electric signals. In assembly, the pin terminal of the flexible substrate is inserted into the pin hole of the main substrate. Then, the flexible substrate is folded so as to package the electronic device in a three-dimensional multichip stack manner.

REFERENCES:
patent: 5448511 (1995-09-01), Paurus et al.
patent: 5789815 (1998-08-01), Tessier et al.
patent: 2004/0094831 (2004-05-01), Aoyagi

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