Three dimensional package for monolithic microwave/millimeterwav

Details Three dimensional package for monolithic microwave/millimeterwav Three dimensional package for monolithic microwave/millimeterwav

1993-08-05

1996-08-13

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257728, 333246, 333247, H01L 2316, H01L 2302, H01L 2312

Patent

active

055459242

ABSTRACT:
A three-dimensional interconnect package is provided for monolithic microwave/millimeterwave integrated circuits. A mating substrate for receiving an MMIC has transmission lines disposed over its surfaces. The mating substrate mounted substantially vertical in a base substrate which also has transmission lines for carrying microwave/millimeterwave signals. The transmission lines on both substrates are put in electrical contact and microwave/millimeterwave signals are transmitted between the substrates with a minimum of signal loss or reflection.

REFERENCES:
patent: 4770640 (1988-09-01), Walter
patent: 4893174 (1990-01-01), Yamada et al.
patent: 5006925 (1991-04-01), Bregman et al.
patent: 5031072 (1991-07-01), Malhi et al.
Abstract-JP patent 61 088 547 A (Fujitsu Ltd.), Patent Abstracts of Japan, vol. 10, No. 263 (E-435)(2319), Sep. 9, 1986.
Abstract-JP patent 03 064 218 A (Mitsubishi Electric), Patent Abstracts of Japan, vol. 15, No. 223(E-1075), Jun. 7, 1991.
Abstract-JP patent 63 194 350 A (Fujitsu Ltd.), Patent Abstracts of Japan, vol. 12, No. 474 (E-692), Dec. 12, 1988.

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