Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1992-01-29
1994-01-18
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257724, 257706, 257720, 257691, H01L 2316, H01L 2302, H01L 2312
Patent
active
052801926
ABSTRACT:
A card structure has an internal three dimensional array of implanted semiconductor chips. The card structure includes a power core and a plurality of chip cores. Each chip core is joined to the power core on opposite surfaces of the power core, and each chip core includes a compensator core having a two dimensional array of chip wells. Each chip well allows for a respective one of the semiconductor chips to be implanted therein. Further, a compliant dielectric material is disposed on the major surfaces of the compensator core except at the bottoms of the chip wells. The compliant dielectric material has a low dielectric constant and has a thermal coefficient of expansion compatible with those of the semiconductor chips and the compensator core, so that thermal expansion stability with the chips and the compensator core is maintained.
REFERENCES:
patent: 4447716 (1984-05-01), Aigo
patent: 4640866 (1987-02-01), Suzuki
patent: 4688648 (1987-08-01), Sorel
patent: 4719140 (1988-01-01), Hara
patent: 4727246 (1988-02-01), Hara
patent: 4729061 (1988-03-01), Brown
patent: 4733061 (1988-03-01), Hegi
patent: 4763188 (1988-08-01), Johnson
patent: 4773955 (1988-09-01), Mabuchi
patent: 4862249 (1989-08-01), Carlson
patent: 4889980 (1989-12-01), Hara
patent: 4894706 (1990-01-01), Sato et al.
patent: 4956694 (1990-09-01), Eide
patent: 4962415 (1990-10-01), Yamamoto et al.
patent: 4980802 (1990-12-01), Champagne et al.
patent: 4985601 (1990-01-01), Hagner
patent: 4990759 (1991-02-01), Gloton et al.
patent: 4994659 (1991-02-01), Yabe et al.
patent: 5016085 (1991-05-01), Hubbard et al.
patent: 5099309 (1992-03-01), Kryzaniwsky
Clark Sheila V.
International Business Machines - Corporation
Lau Richard
LandOfFree
Three-dimensional memory card structure with internal direct chi does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Three-dimensional memory card structure with internal direct chi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three-dimensional memory card structure with internal direct chi will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1138031