LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Chip on board package for imager

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Chip on board package for optical mice and lens cover for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip on board package with top and bottom terminals

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip on board with heat sink attachment and assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Chip on glass package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip on photosensitive device package structure and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Chip package and electrical connection structure between...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Chip package and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Chip package and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Chip package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip package and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip package and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Chip package and process for forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip package and substrate thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip package board having utility rings

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip package device mountable on a mother board in whichever of

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip package device mountable on a mother board in whichever of

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Chip package structure