Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-03-27
2008-12-02
Rose, Kiesha L (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Reexamination Certificate
active
07459778
ABSTRACT:
A leadframe for semiconductor components includes leadfingers, interconnect bonding sites for wire bonding to a semiconductor die, terminal bonding sites for terminal contacts for the component in an area array, and bus bars which electrically connect selected leadfingers to one another. The interconnect bonding sites are located on the leadframe relative to the bus bars such that shorting to the bus bars by wire interconnects is eliminated.
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Fook Jeffrey Toh Tuck
Kim Dalson Ye Seng
Kuan Lee Choon
Gratton Stephen A.
Micro)n Technology, Inc.
Rose Kiesha L
LandOfFree
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