Chip package device mountable on a mother board in whichever of

Details Chip package device mountable on a mother board in whichever of Chip package device mountable on a mother board in whichever of

1997-08-26

1999-10-19

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257786, 257778, H01L 2348

Patent

active

059694173

ABSTRACT:
A chip package device comprises on its outside surface a plurality of wire bonding electrodes adjacent a plurality of facedown electrodes. The chip package device comprises an IC chip having a plurality of chip electrodes on its face surface and a contact sheet having an inside surface on the face surface and comprising on the outside surface a plurality of conductor patterns which comprises portions extending through the contact sheet to the chip electrodes, respectively, and defines the facedown and the wire bonding electrodes. Such chip package devices can be mounted on a printed circuit board in whichever of a facedown and a wire bonding manner when primary and secondary pads are formed on the board for mechanical and electrical connection to the facedown electrodes, respectively, and for electric connection by bonding wires to the wire bonding electrodes, respectively.

REFERENCES:
patent: 4860087 (1989-08-01), Matsubara et al.
patent: 5258330 (1993-11-01), Khandros et al.
patent: 5703405 (1997-12-01), Zeber

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