Chip on photosensitive device package structure and...

Details Chip on photosensitive device package structure and... Chip on photosensitive device package structure and...

2006-03-07

2006-03-07

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S723000, C257S777000

Reexamination Certificate

active

07009287

ABSTRACT:
A chip on photosensitive device package structure is provided. The package mainly comprises a photosensitive device, a transparent plate and a chip. The photosensitive device has an illumination area and a non-illumination area. The transparent plate has a first surface and a corresponding second surface. The transparent plate is set over the photosensitive device with the first surface covering both the illumination area and the non-illumination area. The chip is set on the second surface of the transparent plate above the non-illumination area of the photosensitive device.

REFERENCES:
patent: 6710376 (2004-03-01), Worley

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