Chip on glass package

Details Chip on glass package Chip on glass package

2006-05-23

2006-05-23

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S433000, C257S778000, C257S777000

Reexamination Certificate

active

07049689

ABSTRACT:
A chip on glass package. A glass substrate has a top surface and a corresponding bottom surface. A plurality of chips are flip-chip mounted on the top surface of the glass substrate. The bottom surface of the glass substrate is secured to and electrically connected with a carrier. An encapsulation material is formed around the glass substrate to seal the chips. The encapsulation material has a cavity to expose the contact area of the top surface of the glass substrate. Therefore the chip on glass package is to possess a better protection and electrical connection of the glass substrate.

REFERENCES:
patent: 6140144 (2000-10-01), Najafi et al.
patent: 6404062 (2002-06-01), Taniguchi et al.
patent: 6674159 (2004-01-01), Peterson et al.
patent: 6828665 (2004-12-01), Pu et al.

Affiliated with

Also associated with

Rating

Chip on glass package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip on glass package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip on glass package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3599364