Chip package and substrate thereof

Details Chip package and substrate thereof Chip package and substrate thereof

2011-01-11

2011-01-11

Nguyen, Chuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S679000, C257S706000, C257S713000, C257S737000, C257S777000, C257SE23175, C257SE25029, C438S108000

Reexamination Certificate

active

07868439

ABSTRACT:
A chip package coupled to a circuit board includes a substrate and at least one chip. The substrate includes a plurality of first pads, a plurality of second pads and at least one first interconnecting structure. The first pads and the chip are located on a first surface of the substrate and the second pads are located on a second surface of the substrate. The first interconnecting structure is coupled with the chip, one of the first pads and one of the second pads for flexible design of various applications. A substrate of the chip package is also disclosed.

REFERENCES:
patent: 6008534 (1999-12-01), Fulcher
patent: 6376917 (2002-04-01), Takeshita et al.
patent: 2002/0011676 (2002-01-01), Akram et al.
patent: 2002/0119650 (2002-08-01), Whetsel et al.
patent: 2003/0168256 (2003-09-01), Chien
patent: 2005/0051903 (2005-03-01), Ellsberry et al.
patent: 2005/0146030 (2005-07-01), Miyazaki

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