Chip package board having utility rings

Details Chip package board having utility rings Chip package board having utility rings

1995-10-10

1998-09-01

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257692, 257782, H01L 2352, H01L 2348

Patent

active

058014403

ABSTRACT:
A chip package includes a circuit board having a first surface with an inner die-attach region, an outer signal trace region and an intermediate utility region. Within the utility region are a number of traces for providing fixed electrical potentials to an integrated circuit die mounted within the die-attach region. In the preferred embodiment, the utility region includes a ring-like ground trace, a V.sub.DD trace and a segmented outer trace, with the segments of the segmented trace being connected to at least two fixed voltages for operating the integrated circuit die. Bond wires or leads of a leadframe include inner wire/lead ends connected to input/output pads of the die and include outer wire/lead ends connected to either a trace or trace segment in the utility region or a signal trace located in the outer signal trace region. The resulting chip package may be of the ball grid array type.

REFERENCES:
patent: 4608592 (1986-08-01), Miyamoto
patent: 4631572 (1986-12-01), Zimmerman
patent: 5105257 (1992-04-01), Michii
patent: 5221417 (1993-06-01), Basavanhally
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5245214 (1993-09-01), Simpson
patent: 5376588 (1994-12-01), Pendse
patent: 5386141 (1995-01-01), Liang et al.
patent: 5490324 (1996-02-01), Newman
patent: 5525834 (1996-06-01), Fischer et al.
patent: 5530287 (1996-06-01), Currie et al.

Affiliated with

Also associated with

Rating

Chip package board having utility rings does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip package board having utility rings, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip package board having utility rings will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-272300