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Wafer level package for micro device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Wafer level package having redistribution interconnection...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Wafer level package including a device wafer integrated with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
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Wafer level package including ground metal layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Wafer level package structure and production method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Wafer level package structure with a heat slug

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Wafer level package with die receiving through-hole and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Wafer level package, wafer level packaging procedure for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Wafer level packaging cap and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Wafer level semiconductor package with build-up layer and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Wafer level stackable semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Wafer level system in package and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Wafer level vertical diode package structure and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Wafer packaging and singulation method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Wafer scale burn-in socket

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Wafer scale die handling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Wafer scale fiber optic termination

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Wafer scale of full wafer memory system, packaging method thereo

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Wafer scale package and method of assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
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Wafer stacked package having vertical heat emission path and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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