Wafer scale fiber optic termination

Details Wafer scale fiber optic termination Wafer scale fiber optic termination

2005-03-22

2005-03-22

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S704000, C257S711000

Reexamination Certificate

active

06870259

ABSTRACT:
An optical fiber terminator package (300) has a chip with a surface with one or more light emitting devices (314) and at least one photoreceptor (312) formed on or in the surface. A cap (302) is bonded to the surface of the chip to encapsulate the devices (312, 314). The cap (302) has one or more regions (316, 318) transparent to light passing to or from the devices (312, 314). The cap (302) has been bonded to the semiconductor chip at the wafer stage prior to separation of the wafer into individual packages.

REFERENCES:
patent: 5790730 (1998-08-01), Kravitz et al.
patent: 6374004 (2002-04-01), Han et al.
patent: 19628237 (1997-01-01), None
patent: 2000277753 (2000-10-01), None

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