Structure of power semiconductor with twin metal and ceramic...
Structure of semiconductor element and its manufacturing...
Structures and methods for heat dissipation of semiconductor...
Structures for improving heat dissipation in stacked...
Structures to enhance cooling of computer memory modules
Stud bumps as local heat sinks during transient power...
Stud bumps for die alignment
Sub-ambient temperature electronic package
Subassembly that includes a power semiconductor die and a...
Subcarrier and semiconductor device
Submember mounted on a chip of electrical device for...
Substrate and fabrication method of the same
Substrate assembly with direct electrical connection as a...
Substrate based unmolded package
Substrate connector for integrated circuit devices
Substrate design to improve chip package reliability
Substrate for a flexible microelectronic assembly and a...
Substrate for an integrated circuit package
Substrate for an integrated circuit package and a method of...
Substrate for electrical device