Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-09-12
2006-09-12
Huynh, Andy (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S703000, C257S705000, C257S778000
Reexamination Certificate
active
07105920
ABSTRACT:
A substrate design to improve chip package reliability is provided. The chip package includes a substrate having a ceramic layer formed in a recess. A die is attached to the substrate on the ceramic layer. The substrate may be attached to a printed circuit board. The substrate may be fabricated by forming a recess in a substrate, such as a multi-layer substrate formed of organic dielectric materials. A ceramic layer is then affixed to the substrate in the recess. A die may be attached to the ceramic layer and the substrate may be attached to a printed circuit board.
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Huang Chen-Der
Lin Chuen-Jye
Su Chao-Yuan
Tsao Pei-Haw
Huynh Andy
Slater & Matsil L.L.P.
Taiwan Semiconductor Manufacturing Company , Ltd.
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