Substrate design to improve chip package reliability

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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C257S703000, C257S705000, C257S778000

Reexamination Certificate

active

07105920

ABSTRACT:
A substrate design to improve chip package reliability is provided. The chip package includes a substrate having a ceramic layer formed in a recess. A die is attached to the substrate on the ceramic layer. The substrate may be attached to a printed circuit board. The substrate may be fabricated by forming a recess in a substrate, such as a multi-layer substrate formed of organic dielectric materials. A ceramic layer is then affixed to the substrate in the recess. A die may be attached to the ceramic layer and the substrate may be attached to a printed circuit board.

REFERENCES:
patent: 4866571 (1989-09-01), Butt
patent: 4965660 (1990-10-01), Ogihara et al.
patent: 5315153 (1994-05-01), Nagai et al.
patent: 5541450 (1996-07-01), Jones et al.
patent: 5614330 (1997-03-01), Panzera et al.
patent: 5952646 (1999-09-01), Spartiotis et al.
patent: 6358773 (2002-03-01), Lin et al.
patent: 6528732 (2003-03-01), Okubora et al.
patent: 6569711 (2003-05-01), Susko et al.
patent: 6574106 (2003-06-01), Mori
patent: 6952049 (2005-10-01), Ogawa et al.
patent: 2004/0207059 (2004-10-01), Hong
patent: 2005/0051893 (2005-03-01), Kuo et al.

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