Subassembly that includes a power semiconductor die and a...

Details Subassembly that includes a power semiconductor die and a... Subassembly that includes a power semiconductor die and a...

2011-03-29

2011-03-29

Arora, Ajay K (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S678000, C257S718000, C257SE23080, C438S122000

Reexamination Certificate

active

07915728

ABSTRACT:
The semiconductor assembly includes a first subassembly having a heat sink. Solder material is disposed on the exposed portion of a first surface of heat sink. A power semiconductor die is located on the first surface of the heat sink and is thermally coupled thereto by the solder material. A packaging patterned polymer layer is disposed on a second surface of the heat sink opposing the first surface and defines an interior surface portion of the heat sink. A semiconductor package is provided in which the first subassembly, solder material and die are located such that the interior surface portion of the second surface of the heat sink is not enclosed by the semiconductor package.

REFERENCES:
patent: 4043027 (1977-08-01), Birchler et al.
patent: 4504435 (1985-03-01), Orcutt
patent: 4858073 (1989-08-01), Gregory
patent: 5070039 (1991-12-01), Johnson et al.
patent: 5198964 (1993-03-01), Ito et al.
patent: 5311060 (1994-05-01), Rostoker et al.
patent: 5876765 (1999-03-01), Hinterlechner
patent: 5989474 (1999-11-01), Suzuki
patent: 6362517 (2002-03-01), Bell et al.
patent: 6407459 (2002-06-01), Kwon et al.
patent: 6507120 (2003-01-01), Lo et al.
patent: 6587344 (2003-07-01), Ross
patent: 6624522 (2003-09-01), Standing et al.
patent: 6693349 (2004-02-01), Akram
patent: 6710438 (2004-03-01), Yeo et al.
patent: 6757968 (2004-07-01), Lo et al.
patent: 6890845 (2005-05-01), Standing et al.
patent: 7038311 (2006-05-01), Woodall et al.
patent: 7196415 (2007-03-01), Zhong et al.
patent: 7202111 (2007-04-01), Chiu
patent: 7527090 (2009-05-01), Dani et al.
patent: 2004/0261980 (2004-12-01), Dani et al.
patent: 2005/0046035 (2005-03-01), Egawa
patent: 2005/0062147 (2005-03-01), Wakisaka et al.
patent: 2007/0114677 (2007-05-01), Kwon et al.
patent: 2008/0185713 (2008-08-01), Dani et al.
patent: 2008/0290378 (2008-11-01), Myers et al.
patent: 2009/0014862 (2009-01-01), Chiang et al.
patent: 2003-087739 (2002-07-01), None

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