Structures and methods for heat dissipation of semiconductor...

Details Structures and methods for heat dissipation of semiconductor... Structures and methods for heat dissipation of semiconductor...

2006-09-26

2006-09-26

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S722000, C257S778000, C257S787000, C257S789000, C257S795000, C438S033000, C438S068000, C438S113000, C438S114000, C438S460000

Reexamination Certificate

active

07112882

ABSTRACT:
Structures and methods for semiconductor integrated circuits with respect to heat dissipation are provided. The structure comprises a die having a first surface and a second surface. The first surface has an opening in it, and the second surface has a contact pad formed on it. The first surface is opposite to the second surface. A conductive layer is formed over the first surface, covering a surface of the opening.

REFERENCES:
patent: 3648131 (1972-03-01), Stuby
patent: 3761782 (1973-09-01), Youmans
patent: 3787252 (1974-01-01), Filippazzi et al.
patent: 4842699 (1989-06-01), Hua et al.
patent: 5158911 (1992-10-01), Quentin
patent: 5229647 (1993-07-01), Gnadinger
patent: 5319237 (1994-06-01), Legros
patent: 5378926 (1995-01-01), Chi et al.
patent: 5532506 (1996-07-01), Tserng
patent: 5793117 (1998-08-01), Shimada et al.
patent: 5949140 (1999-09-01), Nishi et al.
patent: 6075712 (2000-06-01), McMahon
patent: 6160308 (2000-12-01), Aoki
patent: 6175160 (2001-01-01), Paniccia et al.
patent: 6188138 (2001-02-01), Bodo et al.
patent: 6423559 (2002-07-01), Ikeya et al.
patent: 6459150 (2002-10-01), Wu et al.
patent: 6597066 (2003-07-01), Farnworth et al.
patent: 6768195 (2004-07-01), Drost
patent: 2003/0146520 (2003-08-01), Fang
patent: 2004/0070058 (2004-04-01), Joshi et al.
patent: 29112 (2003-04-01), None

Affiliated with

Also associated with

Rating

Structures and methods for heat dissipation of semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structures and methods for heat dissipation of semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structures and methods for heat dissipation of semiconductor... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3531887