Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-11-22
2009-11-03
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S717000, C257S719000, C257S720000, C257S726000, C361S704000, C361S710000, C361S711000, C361S717000, C438S123000, C165S080300, C174S016300
Reexamination Certificate
active
07612446
ABSTRACT:
A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom area of the structure.
REFERENCES:
patent: 6465728 (2002-10-01), McLaughlin et al.
patent: 6765797 (2004-07-01), Summers et al.
patent: 7151668 (2006-12-01), Stathakis
patent: 7391613 (2008-06-01), Lai et al.
patent: 2006/0221573 (2006-10-01), Li
patent: 2007/0070607 (2007-03-01), Goodwin
Dang Hien P.
Kamath Vinod
Khanna Vijayeshwar D.
McVicker Gerard
Sri-Jayantha Sri M.
Buchenhorner Michael J.
Chambliss Alonzo
International Business Machines - Corporation
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