Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2007-07-10
2007-07-10
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S678000
Reexamination Certificate
active
11274397
ABSTRACT:
A substrate assembly with direct electrical connection as a semiconductor package is disclosed, which includes a carrier structure formed with at least a cavity; at least a semiconductor chip received in the cavity of the carrier structure having a plurality of electrically connecting pads formed thereon; at least a build-up circuit structure formed on the semiconductor chip and the carrier structure, wherein the build-up circuit structure has conductive structures for electrically connecting to the electrically connecting pads of the semiconductor chip; and a heat sink partially attached to the carrier structure for sealing the cavity. In that the heat sink directly contacts the semiconductor chip, heat generated during operation of the chip can be effectively dissipated, and more mounting space is provided for mounting electronic components, enhancing the electrical property thereof.
REFERENCES:
patent: 5432677 (1995-07-01), Mowatt et al.
patent: 5562971 (1996-10-01), Tsuru et al.
patent: 5583377 (1996-12-01), Higgins, III
patent: 6709898 (2004-03-01), Ma et al.
Phoenix Precision Technology Corporation
Potter Roy
Sawyer Law Group LLP
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