Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-10-31
2006-10-31
Andjuar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S688000, C438S109000, C438S117000
Reexamination Certificate
active
07129572
ABSTRACT:
A submember for electrical device is disclosed. Said submember is mounted on a chip of electrical device. An embodiment for the submember comprised of an insulator and a plurality of conductive elements, wherein the conductive elements embedded in the insulator and a portion of conductive element exposed to the insulator for electrical connection, then (i). the reliability of submember is enhanced; (ii). the material of insulator enables to be saved; and (iii). the thickness of submember is thinner and the heat dissipation of chip enhanced; moreover, a portion of the conductive element may be protruding the insulator for avoiding a short-circuited problem of conductive wire, moreover, the conductive element may be staircase-shaped, then, not only the reliability of submember is enhanced, but the short circuit problem of conductive wire is also avoided; the conductive element may further include an extending portion, furthermore, the conductive element may be placed in a cavity as required.
REFERENCES:
patent: 6765299 (2004-07-01), Takahashi et al.
Andjuar Leonardo
Soderholm Krista
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