Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-07-19
2005-07-19
Clark, S. V. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S686000
Reexamination Certificate
active
06919631
ABSTRACT:
Semiconductor packages including at least two semiconductor dies are disclosed. A first die is mounted on a substrate, which may be a metallized laminate or a leadframe. A rigid support structure is mounted on the substrate over the first die. The support structure may be thermally coupled to the substrate, and also may be electrically coupled to the substrate. A second die is mounted on the support structure, which spaces the second die away from the first die. Encapsulant fills the volume within the support structure, including the vertical space between the pair of dies. In an alternative package embodiment, a heat spreader formed of a flexible metal sheet may be thermally coupled between the two stacked dies. The heat spreader transfers heat from the first and second dies to a heat sink of the substrate. The support structure and the heat spreader mitigate the transfer of heat between the first and second dies.
REFERENCES:
patent: 4763188 (1988-08-01), Johnson
patent: 5012323 (1991-04-01), Farnworth
patent: 5025306 (1991-06-01), Johnson et al.
patent: 5041902 (1991-08-01), McShane
patent: 5166772 (1992-11-01), Soldner et al.
patent: 5200809 (1993-04-01), Kwon
patent: 5291061 (1994-03-01), Ball
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5328870 (1994-07-01), Marrs
patent: 5347429 (1994-09-01), Kohno et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5365107 (1994-11-01), Kuraishi et al.
patent: 5381042 (1995-01-01), Lerner et al.
patent: 5410451 (1995-04-01), Hawthorne et al.
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5455462 (1995-10-01), Marrs
patent: 5463253 (1995-10-01), Waki et al.
patent: 5471011 (1995-11-01), Maslakow
patent: 5478007 (1995-12-01), Marrs
patent: 5482898 (1996-01-01), Marrs
patent: 5485037 (1996-01-01), Marrs
patent: 5495398 (1996-02-01), Takiar et al.
patent: 5502289 (1996-03-01), Takiar et al.
patent: 5530202 (1996-06-01), Dais et al.
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5616957 (1997-04-01), Kajihara
patent: 5629561 (1997-05-01), Shin et al.
patent: 5650593 (1997-07-01), McMillan et al.
patent: 5650663 (1997-07-01), Parthasarathi
patent: 5656864 (1997-08-01), Mitsue et al.
patent: 5689135 (1997-11-01), Ball
patent: 5696031 (1997-12-01), Wark
patent: 5701034 (1997-12-01), Marrs
patent: 5708567 (1998-01-01), Shim et al.
patent: 5715147 (1998-02-01), Nagano
patent: 5721452 (1998-02-01), Fogal et al.
patent: 5722161 (1998-03-01), Marrs
patent: 5723899 (1998-03-01), Shin
patent: 5739581 (1998-04-01), Chillara et al.
patent: 5783860 (1998-07-01), Jeng et al.
patent: 5793108 (1998-08-01), Nakahishi et al.
patent: 5807768 (1998-09-01), Shin
patent: 5815372 (1998-09-01), Gallas
patent: 5854511 (1998-12-01), Shin et al.
patent: 5866949 (1999-02-01), Schueller
patent: 5886412 (1999-03-01), Fogal et al.
patent: 5929513 (1999-07-01), Asano et al.
patent: 5929514 (1999-07-01), Yalamanchili
patent: 5973403 (1999-10-01), Wark
patent: 5977626 (1999-11-01), Wang et al.
patent: 5985695 (1999-11-01), Freyman et al.
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6008991 (1999-12-01), Hawthorne et al.
patent: 6028354 (2000-02-01), Hoffman
patent: RE36613 (2000-03-01), Ball
patent: 6040626 (2000-03-01), Cheah et al.
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6057598 (2000-05-01), Payne et al.
patent: 6069023 (2000-05-01), Bernier et al.
patent: 6072243 (2000-06-01), Nakanishi
patent: 6080264 (2000-06-01), Ball
patent: 6093960 (2000-07-01), Tao et al.
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6166446 (2000-12-01), Masaki
patent: 6198163 (2001-03-01), Crowley et al.
patent: 6214641 (2001-04-01), Akram
patent: 6229204 (2001-05-01), Hembree
patent: 6229702 (2001-05-01), Tao et al.
patent: 6246115 (2001-06-01), Tang et al.
patent: 6258629 (2001-07-01), Niones et al.
patent: 6326696 (2001-12-01), Horton et al.
patent: 6400014 (2002-06-01), Huang et al.
patent: 6429512 (2002-08-01), Huang et al.
patent: 6507098 (2003-01-01), Lo et al.
patent: 6603072 (2003-08-01), Foster et al.
patent: 6650006 (2003-11-01), Huang et al.
patent: 6737750 (2004-05-01), Hoffman et al.
patent: 2002/0109226 (2002-08-01), Khan et al.
patent: 503 201 (1991-12-01), None
patent: 56062351 (1981-05-01), None
patent: 60182731 (1985-09-01), None
patent: 61117858 (1986-06-01), None
patent: 62126661 (1987-06-01), None
patent: 62-126661 (1987-06-01), None
patent: 63128736 (1988-06-01), None
patent: 63-244654 (1988-10-01), None
patent: 1028856 (1989-01-01), None
patent: 64001269 (1989-01-01), None
patent: 1071162 (1989-03-01), None
patent: 1099248 (1989-04-01), None
patent: 3169062 (1991-07-01), None
patent: 4028260 (1992-01-01), None
patent: 4-56262 (1992-02-01), None
patent: 4056262 (1992-02-01), None
patent: 4096358 (1992-03-01), None
patent: 4116859 (1992-04-01), None
patent: 5013665 (1993-01-01), None
patent: 5-75015 (1993-03-01), None
patent: 5109975 (1993-04-01), None
patent: 5136323 (1993-06-01), None
patent: 10-256470 (1998-09-01), None
Hoffman Paul Robert
Zoba David Albert
Amkor Technology Inc.
Clark S. V.
Gunnison McKay & Hodgson, L.L.P.
Hodgson Serge J.
LandOfFree
Structures for improving heat dissipation in stacked... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Structures for improving heat dissipation in stacked..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structures for improving heat dissipation in stacked... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3403576