Plating tail design for IC packages
Plug structure
Plural semiconductor die housed in common package with split hea
Plurality of power elements with gate interconnections...
Polycrystalline diamond heat sink having major surfaces electric
Polyhedral IC package for making three dimensionally expandable
Polymer enhanced column grid array
Polymer solder hybrid interface material with improved...
Polymer stud grid array
Polymer stud grid array
Polymer stud grid array for microwave circuit arrangements
Polysilicon pillar heat sinks for semiconductor on insulator cir
Porous ceramic work stations for wire and die bonders
Portable electronic data carrier
Portable electronic device
Portable semiconductor device with resin
Portable type memory device
Post mounted heat sink method and apparatus
Post-deposition treatment to enhance properties of Si-O-C...
Postless large multichip module with ceramic lid for space...