Polyhedral IC package for making three dimensionally expandable

Details Polyhedral IC package for making three dimensionally expandable Polyhedral IC package for making three dimensionally expandable

1998-05-15

1999-12-28

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257698, 257696, 257685, 257723, 257730, 257738, 257693, 257700, H01L 2504, H01L 2518, H01L 2500, H05K 118

Patent

active

060085304

ABSTRACT:
A polyhedral IC package is provided with a plurality of pins for the purpose of connection to an semiconductor chip on each of the faces thereof, this IC package being stacked or arranged in a row by causing these pins to coincide with one another, thereby enabling three-dimensional arrangement of the IC package and in increase in the number of pins, without having to make the spacing between pins narrower. It is possible to provide an access hole on each face of the polyhedron for the purpose of enabling a physical interface.

REFERENCES:
patent: 4394712 (1983-07-01), Anthony
patent: 5166773 (1992-11-01), Temple et al.
patent: 5291062 (1994-03-01), Higgins, III
patent: 5343346 (1994-08-01), Cipolla et al.
patent: 5434452 (1995-07-01), Higgins, III
patent: 5621190 (1997-04-01), Yamasaki et al.
patent: 5635670 (1997-06-01), Kubota et al.
patent: 5679976 (1997-10-01), Nishikawa et al.
patent: 5723902 (1998-03-01), Katsumata
patent: 5767575 (1998-06-01), Lan et al.
patent: 5781413 (1998-07-01), Howell et al.
patent: 5783870 (1998-07-01), Mostafazadeh et al.
patent: 5793104 (1998-08-01), Kirkman
patent: 5814883 (1998-09-01), Sawai et al.
patent: 5828126 (1998-10-01), Thomas
patent: 5834838 (1998-11-01), Anderson
patent: 5847448 (1998-12-01), Val et al.

Affiliated with

Also associated with

Rating

Polyhedral IC package for making three dimensionally expandable does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyhedral IC package for making three dimensionally expandable , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyhedral IC package for making three dimensionally expandable will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2384113