Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1997-03-21
1999-07-27
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257737, 257778, 257779, H01L 23053
Patent
active
059295163
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
Integrated circuits are being given higher and higher numbers of terminals and are thereby continuing to be miniaturized further. The difficulties with the application of solder paste and with equipping to be anticipated given this increasing miniaturization are to be overcome by new housing forms, whereby single, few or multi chip modules in a ball grid array package are to be particularly emphasized here (German periodical, productornic 5, 1994, pages 54, 55). These modules are based on a through-contacted substrate on which the chips are contacted, for example, via contacting wires or with flip-chip mounting. The ball grid array (BGA), which is often also referred to as solder grid array, land grid array or solder bump array, is situated at the underside of the substrate. At the underside of the substrate, the ball grid array comprises planarly arranged solder bumps that enable a surface mounting on the printed circuit boards or assemblies. High numbers of terminals in a rough grid of, for example, 1.27 mm can be realized as a result of the planar arrangement of the solder bumps.
Injection molded parts with integrated interconnections are employed instead of conventional printed circuits in what is referred to as MID technology (MID=Moulded Interconnection Devices). High-grade thermoplastics that are suitable for the injection molding of three-dimensional substrates are the basis of this technology. Such thermoplastics are distinguished over traditional substrate materials for printed circuits by better mechanical, thermal, chemical, electrical and environmental properties. In a specific direction of MID technology, what is referred to as SIL technology (SIL=Spritzgiessteile mit integrierten the structuring of a metal layer applied onto the injection molded parts ensues with a specific laser structuring method, foregoing the otherwise standard mask technique. A number of mechanical and electrical functions can thereby be integrated into the three-dimensional injection molded parts with structured metallization. The housing carrier function simultaneously assumes guides and snap-in connections, whereas the metallization layer, in addition to the wiring and connecting function, also serves as electromagnetic shielding and sees to a good heat elimination. Further details about the manufacture of three-dimensional injection molded parts with integrated connector trains derive, for example, from German Patent DE-A- 37 32 249 or European Patent EP-A-0 361 192.
U.S. Pat. No. 5,081,520 discloses a method for fastening IC chips on substrates wherein the substrates are produced as injection molded parts with integrated bumps for the fastening of the IC chips. A connecting layer is applied after the metallization, so that the IC chips can be secured to the substrates, whereby the chip terminal surfaces are electrically conductively connected to the allocated metallizations of the bumps.
SUMMARY OF THE INVENTION
The invention is based on the problem of creating a new structural shape for single, few or multi chip modules that exhibits the advantages of MID technology and enables a planar arrangement of the outside terminals as in a ball grid array. To this end, a polymer stud grid array is provided. The polymer stud grid array has an injection molded, three-dimensional substrate composed of an electrically insulating polymer. Polymer studs are co-formed on the underside of the substrate during injection molding. Outside terminals are formed on the polymer studs by a solderable end surface. Interconnections are fashioned at least on the underside of the substrate that connect the outside terminals to inside terminals. At least one chip is arranged on the substrate whose terminals are electrically conductively connected to the inside terminals wherein the polymer studs form the polymer studs planarly arranged in the grid array on the underside of the substrate.
Based on the ball grid array (BGA), the inventive structural shape is referred to as polymer stud grid array (PSGA), whereby t
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"BGA-Die Alternative" from Die Fachzeitschrift fur Elektronic-Fertigung und Test, Productronic 5, 1994, pp. 54 and 55. (In German).
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Beyne Eric
Heerman Marcel
Puymbroeck Jozef Van
Roggen Jean
Van Hoof Rita
Brown Peter Toby
Interuniversitair Micro-Electronica Centrum VZW
Potter Roy
Siemens N.V.
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