Portable semiconductor device with resin

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

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Details

257723, 257687, 361737, G06K 1900

Patent

active

054612560

ABSTRACT:
At least one part of a two-part container of a portable semiconductor device has an electronic part accommodating portion, a foamed resin accommodating portion provided at a peripheral edge portion of the container for accommodating an excess of foamed resin, and a coupling groove for coupling the electronic part accommodating portion to the foamed resin accommodating portion. Since the electronic parts and a circuit board are completely embedded in the device, a semiconductor device exhibiting excellent resistance to environment can be manufactured by a simple process.

REFERENCES:
patent: 4322001 (1982-03-01), Hurley
patent: 4330350 (1982-05-01), Andrews
patent: 4617216 (1986-10-01), Haghiri-Tehrani et al.
patent: 4746392 (1988-05-01), Hoppe
patent: 5013900 (1991-05-01), Hoppe
patent: 5067008 (1991-11-01), Yanaka et al.
patent: 5192682 (1993-03-01), Kodai et al.

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