Polymer solder hybrid interface material with improved...

Details Polymer solder hybrid interface material with improved... Polymer solder hybrid interface material with improved...

2006-04-18

2006-04-18

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S713000

Reexamination Certificate

active

07030483

ABSTRACT:
One embodiment of the invention includes a thermal interface material. The thermal interface material includes a polymer matrix; a plurality of fusible particles dispersed within the polymer matrix; and a plurality of non-fusible particles dispersed within the polymer matrix. The fusible particles have a mean particle size that is greater than the maximum particle size of the non-fusible particles. The thermal interface material improves performance of an integrated circuit.

REFERENCES:
patent: 6469381 (2002-10-01), Houle et al.
patent: 2003/0150604 (2003-08-01), Koning et al.
patent: 2003/0153667 (2003-08-01), Jayaraman et al.

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