Plating tail design for IC packages

Details Plating tail design for IC packages Plating tail design for IC packages

2005-04-19

2005-04-19

Potter, Roy K. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S691000, C257S774000

Reexamination Certificate

active

06882038

ABSTRACT:
A plating tail connected to a signal trace for use during an electroplating operation is fabricated such that it has a substantially different impedance from the signal trace at a characteristic frequency in use, so that adverse reflections during operation are reduced below a threshold of significance.

REFERENCES:
patent: 4581301 (1986-04-01), Michaelson
patent: 20030141107 (2003-07-01), Burton

Affiliated with

Also associated with

Rating

Plating tail design for IC packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plating tail design for IC packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating tail design for IC packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3394219