Plural semiconductor die housed in common package with split hea

Details Plural semiconductor die housed in common package with split hea Plural semiconductor die housed in common package with split hea

1997-08-15

1999-11-02

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257676, 257666, 257796, 257675, 257693, 257678, H01L 2328, H01L 2941, H01L 2336

Patent

active

059776307

ABSTRACT:
A plurality of semiconductor die, which may be of diverse size and diverse junction pattern, are fixed to a common lead frame and within a common package. The semiconductor die are mounted on respective main pad areas that are laterally spaced from one another and which have respective heat sinks. The heat sinks extend from the boundary of the device package and form external pins that are available for external connection at the same or at different potentials. Isolated pins are also provided. The device package may be used for high and low side chopper circuits, synchronous regulator circuits, single-mode bridges, and the like.

REFERENCES:
patent: 4503452 (1985-03-01), Yokozawa et al.
patent: 4617585 (1986-10-01), Yashi
patent: 4750030 (1988-06-01), Hatakeyama
patent: 5019893 (1991-05-01), Frank et al.
patent: 5406120 (1995-04-01), Jones
patent: 5521429 (1996-05-01), Aono et al.
patent: 5789817 (1998-08-01), Richards et al.
patent: 5793106 (1998-08-01), Yasukawa et al.

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