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Pad arrangement of driver IC chip for LCD and related...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Pad array semiconductor device having a heat sink with die recei

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Pad rearrangement substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate

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Pad redistribution chip for compactness, method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Panel and semiconductor component having a composite board...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Panel stacking of BGA devices to form three-dimensional modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Panel stacking of BGA devices to form three-dimensional modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Panel structure with plurality of chip compartments for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Paper including semiconductor device and manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Parallel dual switch module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Parallel plane substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Parallel process interposer (PPI)

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Partially captured oriented interconnections for BGA...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Partitioned integrated circuit package with central clock...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Pass-through 3D interconnect for microelectronic dies and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Passivation layer for packaged integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Passive electronic parts, IC parts, and wafer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Passive element chip and manufacturing method thereof, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Passive interposer including at least one passive electronic com

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Pattern film forming method and pattern film forming apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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