Panel and semiconductor component having a composite board...

Details Panel and semiconductor component having a composite board... Panel and semiconductor component having a composite board...

2006-06-01

2009-11-17

Fahmy, Wael (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S677000, C257S680000, C257S688000, C257S733000, C257S787000, C257S780000, C257S796000, C257SE23001, C257SE23194

Reexamination Certificate

active

07619304

ABSTRACT:
A panel and a semiconductor component including a composite board with semiconductor chips and plastic package molding compound and a method for the production thereof is disclosed. In one embodiment, the panel includes a composite board with semiconductor chips arranged in rows and columns in a corresponding plastic package molding compound with a plurality of semiconductor component positions. The thickness of the plastic package molding compound corresponds to the thickness of the semiconductor chips so that a coplanar upper side and a coplanar rear side are formed on the composite board. Located on the coplanar rear side of the composite board is a plastic layer whose coefficient of thermal expansion corresponds to the coefficient of thermal expansion of the composite board. Located on the coplanar upper side of the composite board is a wiring structure which has corresponding external contacts.

REFERENCES:
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patent: 6723584 (2004-04-01), Kovac et al.
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patent: 2003/0218263 (2003-11-01), Blaszczak et al.
patent: 2004/0232543 (2004-11-01), Goller et al.
patent: 2005/0064628 (2005-03-01), Doescher
patent: 102 13 296 (2003-10-01), None
patent: 1 067 601 (2001-01-01), None

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