Partitioned integrated circuit package with central clock...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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C257S723000, C257S784000, C257S691000, C257SE23141

Reexamination Certificate

active

10977355

ABSTRACT:
Disclosed are IC partitioned packaging and interconnection constructions that provide for improved distribution of power, ground, cross chip interconnections and clocks.

REFERENCES:
patent: 5760487 (1998-06-01), Kimura et al.
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6777799 (2004-08-01), Kikuma et al.
patent: 2003/0141582 (2003-07-01), Yang et al.
patent: 2005/0051887 (2005-03-01), Siniaguine
patent: 2005/0139985 (2005-06-01), Takahashi
patent: 359127856 (1984-07-01), None

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