Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2005-01-14
2008-12-09
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C438S106000, C438S584000
Reexamination Certificate
active
07462927
ABSTRACT:
A pattern film forming method includes a step of producing a transfer sheet in which a thin film is formed on a surface of a sheet-shaped material and a step of pressing the thin film against a pattern film formation surface of the substrate with a pressing member having convex portions corresponding to the pattern film from a reverse surface of the transfer sheet opposite to the thin film or a reverse surface of the substrate opposite to the pattern film formation surface to transfer the thin film to the substrate. A pattern film forming apparatus includes a sheet supply device, a pressing device and a substrate transport device. A high-definition pattern film having a desired pattern and a sharp edge can be formed with high productivity.
REFERENCES:
patent: 3915780 (1975-10-01), Broussard et al.
patent: 6099678 (2000-08-01), Kotato et al.
patent: 6284307 (2001-09-01), Fukuzawa et al.
patent: 6689245 (2004-02-01), Tsujimoto
patent: 2003/0062116 (2003-04-01), Lee
patent: 2004/0188814 (2004-09-01), Houle et al.
patent: 2004/0200061 (2004-10-01), Coleman et al.
patent: 2918037 (1999-04-01), None
patent: 2003-139944 (2003-05-01), None
patent: 2003-173870 (2003-06-01), None
Fujinawa Jun
Kataoka Takashi
Nakada Junji
Shibata Norio
FUJIFILM Corporation
Jr. Carl Whitehead
Mitchell James M
Sughrue & Mion, PLLC
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