Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2011-08-09
2011-08-09
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257S786000, C257SE25006, C257SE25013, C257SE25018, C257SE25021, C257SE25027, C257SE23085, C257SE23015, C257SE23020
Reexamination Certificate
active
07994627
ABSTRACT:
A substrate includes a substrate; a number of pad redistribution chips stacked on the substrate and on one another after being rotated 90° in a predetermined direction relative to one another, the pad redistribution chips having a number of center pads positioned at the center thereof, a number of (+) edge pads positioned on an end thereof while corresponding to those of the center pads lying in (+) direction from a middle center pad located in the middle of the center pads, a number of (−) edge pads positioned on the other end thereof while corresponding to those of the center pads lying in (−) direction with symmetry to those of the center pads lying in the (+) direction, and a number of traces for electrically connecting the center pads to the corresponding (±) edge pads, respectively; a flexible PCB for electrically connecting the substrate to the pad redistribution chips; and an anisotropic dielectric film for electrically connecting the pad redistribution chips to the flexible PCB and the substrate to the flexible PCB.
REFERENCES:
patent: 5854508 (1998-12-01), Kajigaya et al.
patent: 6150728 (2000-11-01), Tsukude et al.
Clark Jasmine J
Hynix / Semiconductor Inc.
Ladas & Parry LLP
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