Gull-wing zig-zag inline lead package having end-of-package anch

Details Gull-wing zig-zag inline lead package having end-of-package anch Gull-wing zig-zag inline lead package having end-of-package anch

1993-01-28

1994-11-22

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257696, 257701, 257733, 361748, 361772, 361783, 361807, H01L 3902, H01L 2316, H01L 2342, H01L 2344

Patent

active

RE0347949

ABSTRACT:
A semiconductor package having a gull-wing, zig-zag, inline-lead configuration and end-of-package anchoring devices for rigidly affixing the package to a circuit board such that each lead is in compressibe contact with its associated mounting pad on the board. The anchoring devices of a first embodiment comprise anchoring pins having fish-hook-type barbs which lock against the under side of the board when the pegs are inserted through holes in the board; a second embodiment utilizes anchoring pins which are adhesively bonded in recesses that have been drilled or molded into the board; a third embodiment utilizes anchoring pins, the ends of which can be bonded directly to planar peg-bonding regions on the surface of the board; and a fourth utilizes tapered anchoring ping which may be inserted with an interference fit into holes in the board. The invention eliminates the need for mechanical support of the packages during solder reflow operations used during board assembly and repair.

REFERENCES:
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patent: 3162721 (1964-12-01), Rayburn
patent: 3524108 (1970-08-01), English
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patent: 4155615 (1979-05-01), Zimmerman, Jr. et al.
patent: 4611389 (1986-09-01), Blair et al.
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patent: 4698660 (1987-10-01), Kubota et al.
patent: 4736520 (1988-04-01), Morris
patent: 4967262 (1990-10-01), Farnsworth
patent: 4975763 (1990-12-01), Baudouin et al.

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