Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate
2011-06-21
2011-06-21
Ngo, Ngan (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With window means
C257S681000, C257SE21124, C257SE23192
Reexamination Certificate
active
07964945
ABSTRACT:
A glass cap molding package includes a substrate with an external connection terminal formed on a peripheral region of a top surface; an image sensor mounted on the top surface of the substrate; a transparent member installed on an upper part of the image sensor; and a molding unit formed to seal the image sensor and the transparent member. The mold unit exposes the external connection terminal of the substrate to a lateral surface of the substrate. The glass cap molding package and a manufacturing method thereof and a camera module including the same reduce a manufacturing cost and improve productivity by manufacturing a small module in comparison with a conventional module and simplifying a process.
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Notice of Allowance issued Aug. 31, 1999 by the Korean Patent Office.
Kim Bo Kyoung
Kim Jung Jin
Lee Jung Seok
Park Hyung Kyu
Ryu Jin Mun
Lowe Hauptman & Ham & Berner, LLP
Ngo Ngan
Samsung Electro-Mechanics Co. Ltd.
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