Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-01-11
2005-01-11
Thomas, Tom (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S707000, C257S718000, C257S720000, C257S747000
Reexamination Certificate
active
06841867
ABSTRACT:
A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si—H unit; an amount of at least one thermally conductive first filler, and at least one thermally conductive second filler, wherein a melting point of the first filler is greater than the melting point of the second filler. An apparatus including a package configured to mate with a printed circuit board; a semiconductor device coupled to the package; a thermal element; and a curable thermal material disposed between the thermal element and the semiconductor device.
REFERENCES:
patent: 6469379 (2002-10-01), Matayabas, Jr.
patent: 6597575 (2003-07-01), Matayabas et al.
patent: 6657297 (2003-12-01), Jewram et al.
patent: 20020000239 (2002-01-01), Sachdev et al.
Dani Ashay A.
Koning Paul A.
Matayabas, Jr. James C.
Rumer Christopher L.
Blakely , Sokoloff, Taylor & Zafman LLP
Fenty Jesse A.
Thomas Tom
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