Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Patent
1997-09-30
2000-02-22
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With window means
257680, 257688, 257689, 257701, 257678, 257703, 257726, 257727, H01L 2302, H01L 2312
Patent
active
060283513
ABSTRACT:
A gasket sealed integrated circuit package (10) including a top member (12) clamped to a bottom member (18) with a gasket seal ring (26) sealed therebetween. Seal ring (26) encompasses an active portion (30) of an integrated circuit (22) to seal an active portion (30) from the ambient without inducing warp or stress on the circuit (30). The package further includes a glass lid (16) clamped within the package. The integrated circuit (22) preferably comprises a micromechanical device (30) formed on a ceramic substrate (24), such as a DMD type spatial light modulator, but can comprise of other devices as well. The package can be easily disassembled to change out the glass lid (16) or integrated circuit substrate (24) and allows sealing of the substrate (24) without subjecting the integrated circuit die (30) to elevated temperatures. The present invention is especially suited for elongated integrated circuits (30).
REFERENCES:
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Harmon Larry A.
Hyde Don
Klonis Homer B.
McKenna Robert G.
Brill Charles A.
Chambliss Alonzo
Chaudhuri Olik
Donaldson Richard L.
Telecky Jr. Frederick J.
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