Ground arch for wirebond ball grid arrays

Details Ground arch for wirebond ball grid arrays Ground arch for wirebond ball grid arrays

2007-05-15

2007-05-15

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S690000, C257S706000, C257S773000, C257SE23080, C257SE23101, C438S122000, C438S125000

Reexamination Certificate

active

10565044

ABSTRACT:
A structure provides for the control of bond wire impedance. In an example embodiment, there is an integrated circuit device comprising a semiconductor device die having a plurality of grounding pads, signal pads, and power pads and a package for mounting the integrated circuit and includes a conductive path having at least one reference trace that surrounds the integrated circuit. A grounding arch is disposed over the semiconductor device die.

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