Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-06-01
2009-02-17
Chu, Chris C. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257SE33058, C257S415000, C257S416000, C257S706000, C438S011000, C438S050000, C359S291000
Reexamination Certificate
active
07492040
ABSTRACT:
The encapsulation lid comprises at least two glass layers of different compositions, a first layer called the bottom layer, which is continuous, and at least a second layer, which is discontinuous and designed so as to define cavities or anfractuosities in this lid. Preferably, the glass layers other than the first layer are preferably formed from low-melting-point frits, thereby allowing such lids to be manufactured economically, without recourse to glass machining.
REFERENCES:
patent: 4206382 (1980-06-01), DuBois
patent: 6470594 (2002-10-01), Boroson et al.
patent: 6489719 (2002-12-01), Young et al.
patent: 6798133 (2004-09-01), Ambrugger et al.
patent: 6998776 (2006-02-01), Aitken et al.
patent: 2003/0066311 (2003-04-01), Li et al.
patent: 2003/0230976 (2003-12-01), Nishikawa et al.
patent: 1 411 562 (2004-04-01), None
“Corning 1737 AMLCD Glass Substrates.” 2003. Corning, accessed on Jul. 9, 2007. URL: http://www.vinkarola.com/pdf/Corning%20Glass%201737%20Properties.pdf.
Chu Chris C.
Fried Harvey D.
Laks Joseph J.
Thomson Licensing
Verlangieri Patricia
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