LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

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Flip clip attach and copper clip attach on MOSFET device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip-chip ball grid array package with a heat slug

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip-chip bonding structure and method for making the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip-chip die and flip-chip package substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip-chip image sensor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip-chip light emitting diode package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip-chip package substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip-chip package substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip-chip package with optimized encapsulant adhesion and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip-chip semiconductor device having an improved reliability

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip-chip semiconductor device having I/O modules in an...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip-chip semiconductor device with improved power pad...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip-chip sub-assembly, methods of making same and device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Fluid cooled encapsulated microelectronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Fluid cooled encapsulated microelectronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Fluid cooled semiconductor power module having double-sided...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Fluid-cooled power transistor arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Fluoropolymer dielectric composition for use in circuitized...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Fluxless die-to-heat spreader bonding using thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Foldable, flexible laminate type semiconductor apparatus...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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