Flip-chip semiconductor device with improved power pad...

Details Flip-chip semiconductor device with improved power pad... Flip-chip semiconductor device with improved power pad...

2006-01-18

2009-10-13

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S773000, C257S776000, C257S778000, C257SE23079, C257SE23153

Reexamination Certificate

active

07602058

ABSTRACT:
A semiconductor device is composed of a power supply interconnection extending from a certain starting point in a first direction and also extending from the starting point in a second direction orthogonal to the first direction, a plurality of power pads, and connecting interconnections providing electrical connection between the power supply interconnection and the power pads. The power supply interconnection, the power pads, and the connecting interconnections are arranged in a symmetrical manner with respect to a symmetry line crossing the starting point and extending in a direction at an angle of 45 degree to the first and second directions.

REFERENCES:
patent: 6653726 (2003-11-01), Schultz et al.
patent: 2000-277656 (2000-10-01), None
patent: 2002-190526 (2002-07-01), None
patent: 2003-68852 (2003-03-01), None
patent: 2003-124318 (2003-04-01), None
patent: 2002-008404 (2001-05-01), None

Affiliated with

Also associated with

Rating

Flip-chip semiconductor device with improved power pad... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip-chip semiconductor device with improved power pad..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip-chip semiconductor device with improved power pad... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4079169